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| RED 1. 2. 2.1 2.2 Item No.: 191210 This specification applies to GaP / GaP LED Chips Structure Mesa structure Electrodes p-side (anode) n-side (cathode) Au alloy Au alloy 3. Outlines (dimensions in microns) p-Electrode p-Epitaxy GaP 265 120 270 n-Epitaxy GaP n-Epitaxy GaP n-Substrate GaP 265 n-Electrode Wire bond contacts can also be circular or square 4. Electrical and optical characteristics (T=25C) Parameter Forward voltage Reverse current Luminous intensity * Symbol VF IR IV Conditions IF = 20 mA VR = 5 V IF = 5 mA min typ 2,25 max 2,50 10 Unit V A cd nm 400 600 Peak wavelength P IF = 5 mA 700 * On request, wafers will be delivered according to luminous intensity classes Brightness measurement at OSA on gold plate 5. Packing Dice on adhesive film with 1) wire bond side on top 2) back contact on top 6. Labeling Type Lot No. IV typ min max Quantity (c) 2004 OSA Opto Light GmbH Tel. +49-(0)30-65 76 26 83 Fax +49-(0)30-65 76 26 81 contact@osa-opto.com |
Price & Availability of 191210
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